Bonding in Microsystem Technology (Springer Series in by Jan A. Dziuban

By Jan A. Dziuban

This can be the 1st compendium on silicon/glass microsystems made through deep rainy etching and the 1st publication with an in depth description of bonding innovations utilized in microsystem expertise. Technological effects offered within the booklet were confirmed experimentally by way of the writer and his group, and will be used in daily laboratory perform. particular consciousness has been paid to the top point of accessibility of the ebook by way of scholars.

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Example text

It may be assumed that temperature mainly influences the etch rate and anisotropy factor, while concentration affects the anisotropy and, to a smaller extent, etch rates. Moreover, water solution KOH etches silicon slowly, but this is a disadvantage common to all known alkaline solutions*. Etching of silicon substrates is performed in a glass apparatus (Fig. 11) under atmospheric pressure. The solution is heated to the required temperature, Fig. 11. Stand for silicon etching: a) scheme, b) its appearance.

Quality parameters of the epitaxial layers cannot differ significantly from the standards common for microelectronics processes. For special applications SOI (silicon-on-insulator) substrates with a Fig. 8. Top and back-side view of (111), (100), (110) crystallographic planes at the (100) and (110) substrates. 4. 5° 360 to 450 mm 3 inches: ~10 mm >4 inches: ~10 mm 3 inches: <10 mm >4 inches: <20 mm <100 cm max. 5 buried silicon dioxide layer are utilized. This will be discussed in later sections of the book.

As mentioned above, the surface of micromechanical substrates is usually aligned to crystallographic planes (100) or (110). These substrates are often called substrates (wafers) (100) or (111). To mark the type of conductivity and crystallographic orientation of the surface of substrates, these so-called flats (coding marks) are produced. The flats (usually two) are made by suitably grinding off the edges of the wafers. Flats correspond to the chosen crystallographic direction, seen from a bird’s eye view on the substrate (Fig.

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